On the 4th, a Japanese life insurance company filed a lawsuit against OpenAI in the United States, alleging that ChatGPT provided inappropriate legal advice that resulted in legal disputes for the company. This case raises questions about AI liability in legal applications and may influence future AI regulatory policies.
Meta has announced plans to develop custom chips while establishing a new applied AI engineering department. The initiative aims to strengthen the company's capabilities in AI model development. By pursuing in-house chip manufacturing and dedicating specialized engineering resources, Meta seeks to advance its artificial intelligence technology development and deployment efforts.
Texas Instruments and NVIDIA announced a collaboration to advance humanoid robot deployment in real-world applications. TI contributes motor control, sensing, radar, and power technologies, while NVIDIA provides advanced robotics computing and simulation capabilities. The partnership enables developers to validate perception and actuation systems more efficiently, accelerating the transition from virtual development to scalable, production-ready systems that meet safety standards.
As the global artificial intelligence industry experiences rapid growth, semiconductor supply chain stability has become a critical focus for major technology companies. Broadcom has reached a long-term partnership agreement with TSMC to secure advanced process and high-bandwidth memory (HBM) capacity through 2028. This agreement reflects major chip designers' efforts to lock in manufacturing capacity amid sustained demand for AI chips.
On March 7, Chinese scientists employed artificial intelligence models to analyze samples from the lunar far side collected by the Chang'e-6 mission, successfully studying the chemical composition of the region. The research utilized AI technology to process sample data, providing new scientific evidence and insights into long-standing questions in lunar science.
As the AI industry experiences rapid expansion, SK Hynix is progressing with the development of next-generation high-bandwidth memory HBM4. The company's new DRAM thinning process has entered the verification stage, aimed at enhancing product performance and securing market leadership. HBM4 serves as a critical component supporting global AI infrastructure, with its technological advancement directly impacting AI chip performance.
The emergence of agentic AI is reshaping data center computing requirements. Unlike early GPU-intensive models, agentic AI requires complex logic branching, task synchronization, and multi-threaded processing. Cornell University research indicates CPU contributes approximately 44% of computational power in agentic AI workflows. HSBC forecasts 2026 server shipments will grow 20%, with potential demand reaching 60%, signaling entry into a new super-cycle for AI servers.
Bank of America's global research team reports the memory chip industry is entering a supercycle with supply-demand mismatches expected to persist for years, systematically elevating industry profitability. The Middle East conflict has minimal impact on global memory chip supply chains due to the industry's highly integrated Asian ecosystem. Manufacturing concentrates in South Korea, Taiwan, and Japan, with testing distributed across East and Southeast Asia, while downstream demand comes primarily from cloud service providers and AI server makers in Asia-Pacific and North America.
The Japanese government has set an ambitious goal to increase domestic chip sales to 40 trillion yen (approximately 253.5 billion USD) by 2040, representing an eightfold increase from 2020 levels. This initiative aims to capitalize on growing opportunities in artificial intelligence and data center industries, strengthening Japan's competitive position in the global semiconductor market.
Japanese authorities are in discussions with Japan Display Inc. (JDI) to establish an advanced panel manufacturing facility in the United States. The project is valued at approximately 13 billion US dollars and forms part of Japan's broader 550 billion US dollar investment initiative in America. This move aims to strengthen Japan's industrial presence in the US and advance the production of cutting-edge display technology in North America.